The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 19, 2017

Filed:

Jul. 23, 2014
Applicant:

Advanced Silicon Group, Inc., Lincoln, MA (US);

Inventors:

Michael Jura, Santa Monica, CA (US);

Marcie R. Black, Lincoln, MA (US);

Jeffrey B. Miller, Brookline, MA (US);

Joanne Yim, San Francisco, CA (US);

Joanne Forziati, Everett, MA (US);

Brian P. Murphy, Revere, MA (US);

Richard Chleboski, Medway, MA (US);

Assignee:

Advanced Silicon Group, Inc., Lincoln, MA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 31/044 (2014.01); H01L 31/0236 (2006.01); B82Y 30/00 (2011.01); H01L 31/0224 (2006.01); H01L 31/0352 (2006.01); H01L 31/0216 (2014.01); H01L 31/0312 (2006.01); H01L 31/0368 (2006.01); H01L 31/0376 (2006.01); H01L 31/18 (2006.01); H01L 29/06 (2006.01);
U.S. Cl.
CPC ...
H01L 31/02363 (2013.01); B82Y 30/00 (2013.01); H01L 31/02167 (2013.01); H01L 31/022425 (2013.01); H01L 31/022433 (2013.01); H01L 31/0312 (2013.01); H01L 31/03682 (2013.01); H01L 31/03762 (2013.01); H01L 31/035227 (2013.01); H01L 31/1868 (2013.01); H01L 29/0673 (2013.01); Y02E 10/50 (2013.01);
Abstract

A process is provided for contacting a nanostructured surface. The process may include (a) providing a substrate having a nanostructured material on a surface, (b) passivating the surface on which the nanostructured material is located, (c) screen printing onto the nanostructured surface and (d) firing the screen printing ink at a high temperature. In some embodiments, the nanostructured material compromises silicon. In some embodiments, the nanostructured material includes silicon nanowires. In some embodiments, the nanowires are around 150 nm, 250 nm, or 400 nm in length. In some embodiments, the nanowires have a diameter range between about 30 nm and about 200 nm. In some embodiments, the nanowires are tapered such that the base is larger than the tip. In some embodiments, the nanowires are tapered at an angle of about 1 degree, about 3 degrees, or about 10 degrees. In some embodiments, a high temperature can be approximately 700 C, 750 C, 800 C, or 850 C.


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