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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9768140 B1

PDFFull Text
Date of Patent:
Sep. 19, 2017

Filed:

Oct. 16, 2014

Method for fabricating package structure

Applicant:

Siliconware Precision Industries Co., Ltd., Taichung, TW;

Inventors:

Yan-Heng Chen, Taichung, TW;

Mu-Hsuan Chan, Taichung, TW;

Chieh-Yuan Chi, Taichung, TW;

Assignee:

Siliconware Precision Industries Co., Ltd., Taichung, TW;

Attorneys:

Mintz Levin Cohn Ferris Glovsky and Popeo, P.C.

Peter F. Corless

Steven M. Jensen

Primary Examiner:

Yuanda Zhang

Assistant Examiner:

Sheikh Maruf

Int. Cl.
CPC ...
H01L 21/00 (2006.01); H01L 23/00 (2006.01); H01L 21/56 (2006.01); H01L 21/311 (2006.01); H01L 23/31 (2006.01);
U.S. Cl.
CPC ...
H01L 24/19 (2013.01); H01L 21/561 (2013.01); H01L 24/20 (2013.01); H01L 21/31144 (2013.01); H01L 21/568 (2013.01); H01L 23/3128 (2013.01); H01L 2224/04105 (2013.01); H01L 2224/12105 (2013.01); H01L 2225/1035 (2013.01); H01L 2924/37001 (2013.01);
Abstract

A method for fabricating a package structure is provided, which includes the steps of: providing an encapsulant encapsulating at least an electronic element; forming a shaping layer on a surface of the encapsulant, wherein the shaping layer has at least an opening exposing a portion of the surface of the encapsulant; forming at least a through hole corresponding in position to the opening and penetrating the encapsulant; and forming a conductor in the through hole. The shaping layer facilitates to prevent deformation of the through hole.

Find Patent Forward Citations

Chen, Yan-Heng. (2017). Method for fabricating package structure (U.S. Patent No. 9768140). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9768140

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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