The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 19, 2017
Filed:
Jan. 14, 2015
Applicant:
Ams Ag, Unterpremstaetten, AT;
Inventors:
Assignee:
AMS AG, Unterpremstaetten, AT;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/76 (2006.01); H01L 21/768 (2006.01); H01L 23/00 (2006.01); G01N 27/12 (2006.01); H01L 23/48 (2006.01);
U.S. Cl.
CPC ...
H01L 24/02 (2013.01); G01N 27/12 (2013.01); G01N 27/128 (2013.01); H01L 21/76898 (2013.01); H01L 24/05 (2013.01); H01L 24/13 (2013.01); H01L 23/481 (2013.01); H01L 2224/02315 (2013.01); H01L 2224/02331 (2013.01); H01L 2224/02372 (2013.01); H01L 2224/02373 (2013.01); H01L 2224/0401 (2013.01); H01L 2224/05024 (2013.01); H01L 2224/13026 (2013.01);
Abstract
A wiring () comprising electrical conductors () is formed in a dielectric layer () on or above a semiconductor substrate (), an opening is formed in the dielectric layer to uncover a contact pad (), which is formed by one of the conductors, and a further opening is formed in the dielectric layer to uncover an area of a further conductor (), separate from the contact pad. The further opening is filled with an electrically conductive material (), and the dielectric layer is thinned from a side opposite the substrate, so that the electrically conductive material protrudes from the dielectric layer.