The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 19, 2017

Filed:

Sep. 26, 2016
Applicant:

Samsung Electronics Co., Ltd., Suwon-si, Gyeonggi-do, KR;

Inventors:

Jorge A. Kittl, Austin, TX (US);

David Seo, Seoul, KR;

Kota Oikawa, Seoul, KR;

Kim Changhwa, Hwaseong, KR;

Rwik Sengupta, Austin, TX (US);

Mark S. Rodder, Dallas, TX (US);

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/44 (2006.01); H01L 21/768 (2006.01);
U.S. Cl.
CPC ...
H01L 21/76879 (2013.01); H01L 21/76846 (2013.01);
Abstract

A method for forming a low parasitic capacitance contact to a source-drain structure of a fin field effect transistor device. In some embodiments the method includes etching a long trench down to the source-drain structure, the trench being sufficiently long to extend across all the of source-drain regions of the device. A conductive layer is formed on the source-drain structure, and the trench is filled with a first fill material. A second, narrower trench is opened along a portion of the length of the first trench, and filled with a second fill material. The first fill material may be conductive, and may form the contact. If the first fill material is not conductive, a third trench may be opened, in the portion of the first trench not filled with the second fill material, and filled with a conductive material, to form the contact.


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