The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 19, 2017
Filed:
Nov. 20, 2012
Miraial Co., Ltd., Tokyo, JP;
Shin-etsu Polymer Co., Ltd., Tokyo, JP;
Chiaki Matsutori, Tokyo, JP;
Tsuyoshi Nagashima, Tokyo, JP;
Takaharu Oyama, Tokyo, JP;
Shuichi Inoue, Tokyo, JP;
Hiroyuki Shida, Saitama, JP;
Hiroki Yamagishi, Saitama, JP;
Kazumasa Ohnuki, Saitama, JP;
MIRAIAL CO., LTD., Tokyo, JP;
SHIN-ETSU POLYMER CO., LTD., Tokyo, JP;
Abstract
The lid body side wafer support parts allow flexibility to be exhibited and supports the wafers. If a closed state substrate is defined as being a wafer which is stored in the substrate storing space in a container main body in a state wherein the container main body opening portion is closed by the lid body, and a closed time center is defined as being the center of a closed state substrate, the back side substrate support portion, when a closed state substrate is viewed in the thickness direction, are disposed in a pair about a depth direction reference line and support the wafer. A center angle which the back side substrate support portion form toward the depth direction with respect to a left/right direction reference line when a closed state substrate is viewed in the thickness direction is 20-55°.