The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 19, 2017

Filed:

Jan. 28, 2015
Applicant:

International Business Machines Corporation, Armonk, NY (US);

Inventors:

Geraud J. Dubois, Los Altos, CA (US);

Jane E. Frommer, San Jose, CA (US);

Robin S. King, Half Moon Bay, CA (US);

Krystelle Lionti, Campbell, CA (US);

Kumar R. Virwani, San Jose, CA (US);

Willi Volksen, San Jose, CA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G01N 3/42 (2006.01);
U.S. Cl.
CPC ...
G01N 3/42 (2013.01); G01N 2203/0218 (2013.01); G01N 2203/0286 (2013.01);
Abstract

A method and computer product program for determining Young's modulus. The method includes placing a probe in contact with a surface of a material on a substrate and, with an initial force of 800 nano newtons or less; determining the location of the surface relative to an initial indentation depth for the initial force; increasing the force on the probe from the initial force to a maximum force greater than the initial force to generate a load curve; decreasing the force on the probe from the maximum force to the initial force to generate an unload curve, the maximum force selected such that the unload curve is independent of the presence of the substrate; and using the unload curve, determining a relationship between (i) the reduced modulus of the sample material and (ii) the ratio of probe penetration depth and the thickness of the layer.


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