The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 12, 2017

Filed:

Nov. 11, 2015
Applicant:

Shinko Electric Industries Co., Ltd., Nagano-shi, Nagano, JP;

Inventor:

Kazuhiro Kobayashi, Nagano, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/03 (2006.01); H05K 3/04 (2006.01); H05K 3/00 (2006.01); H05K 3/46 (2006.01); H01L 23/498 (2006.01); H01L 21/48 (2006.01);
U.S. Cl.
CPC ...
H05K 3/04 (2013.01); H01L 21/4857 (2013.01); H01L 23/49822 (2013.01); H01L 23/49827 (2013.01); H05K 3/0097 (2013.01); H05K 3/4682 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/73204 (2013.01); H05K 2203/122 (2013.01); H05K 2203/1383 (2013.01); Y10T 428/239 (2015.01);
Abstract

A method of manufacturing a support body includes: (a) preparing a support substrate; (b) preparing a metal foil on which a peeling layer is provided; (c) providing an adhesion adjusting layer on the support substrate in a certain region of the support substrate excluding an outer peripheral portion of the support substrate, wherein the adhesion adjusting layer is configured to adjust a contact area between the peeling layer and the support substrate; and (d) providing the metal foil on the support substrate such that the peeling layer provided on the metal foil faces the support substrate via the adhesion adjusting layer. In step (d), the adhesion adjusting layer is adhered to the support substrate, and the peeling layer is adhered to the outer peripheral portion of the support substrate, and is in contact with the adhesion adjusting layer but is not adhered to the adhesion adjusting layer.


Find Patent Forward Citations

Loading…