The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 12, 2017
Filed:
Jul. 08, 2014
Applicant:
United Microelectronics Corp., Hsin-Chu, TW;
Inventors:
Jian-Bin Shiu, Hsinchu, TW;
Tung-Sheng Lee, Hsinchu, TW;
Assignee:
UNITED MICROELECTRONICS CORP., Hsin-Chu, TW;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 43/04 (2006.01); H01L 23/00 (2006.01); H01L 43/14 (2006.01); H01L 43/06 (2006.01);
U.S. Cl.
CPC ...
H01L 43/04 (2013.01); H01L 24/03 (2013.01); H01L 24/05 (2013.01); H01L 43/14 (2013.01); H01L 43/065 (2013.01); H01L 2224/05541 (2013.01); H01L 2224/05553 (2013.01); H01L 2224/05558 (2013.01);
Abstract
A structure of a conductive pad is provided. The structure includes a first conductive layer. A first dielectric layer covers the first conductive layer. A first contact hole is disposed within the first dielectric layer. A second conductive layer fills in the first conductive hole and extends from the first conductive hole to a top surface of the first dielectric layer so that the second conductive layer forms a step profile. A second dielectric layer covers the first dielectric layer and the second conductive layer. A third conductive layer contacts and covers the step profile.