The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 12, 2017

Filed:

Dec. 30, 2014
Applicant:

Veeco Instruments, Inc., Plainview, NY (US);

Inventors:

Ajit Paranjpe, Basking Ridge, NJ (US);

Craig Metzner, Simi Valley, CA (US);

Joe Lamb, Camarillo, CA (US);

Assignee:

Veeco Instruments, Inc., Plainview, NY (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/18 (2006.01); H01L 21/304 (2006.01); H01L 21/683 (2006.01); H01L 29/20 (2006.01); H01L 33/00 (2010.01);
U.S. Cl.
CPC ...
H01L 29/2003 (2013.01); H01L 21/187 (2013.01); H01L 21/304 (2013.01); H01L 21/6835 (2013.01); H01L 21/6836 (2013.01); H01L 33/0079 (2013.01); H01L 33/0075 (2013.01); H01L 2221/68368 (2013.01); H01L 2221/68381 (2013.01);
Abstract

A spalling process can be employed to generate a fracture at a predetermined depth within a high quality crystalline nitride substrate, such as a bulk GaN substrate. A first crystalline conductive film layer can be separated, along the line of fracture, from the crystalline nitride substrate and subsequently bonded to a layered stack including a traditional lower-cost substrate. If the spalled surface of the first crystalline conductive film layer is exposed in the resulting structure, the structure can act as a substrate on which high quality GaN-based devices can be grown.


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