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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9761476 B1

PDFFull Text
Date of Patent:
Sep. 12, 2017

Filed:

Dec. 29, 2014

Dicing film and dicing die-bonding film

Applicant:

Lg Chem, Ltd., Seoul, KR;

Inventors:

Se Ra Kim, Daejeon, KR;

Jung Ho Jo, Daejeon, KR;

Young Kook Kim, Daejeon, KR;

Hee Jung Kim, Daejeon, KR;

Kwang Joo Lee, Daejeon, KR;

Jung Hak Kim, Daejeon, KR;

Seung Hee Nam, Daejeon, KR;

Assignee:

LG CHEM, LTD., Seoul, KR;

Attorney:

Rothwell, Figg, Ernst & Manbeck, P.C.

Primary Examiner:

Brook Kebede

Int. Cl.
CPC ...
H01L 21/00 (2006.01); H01L 21/683 (2006.01); C09J 133/04 (2006.01); C09J 7/02 (2006.01); H01L 23/00 (2006.01); C09D 133/04 (2006.01);
U.S. Cl.
CPC ...
H01L 21/6836 (2013.01); C09D 133/04 (2013.01); C09J 7/0296 (2013.01); C09J 133/04 (2013.01); H01L 24/27 (2013.01); H01L 24/29 (2013.01); C09J 2203/326 (2013.01); C09J 2400/22 (2013.01); C09J 2433/006 (2013.01); C09J 2463/00 (2013.01); H01L 24/32 (2013.01); H01L 24/94 (2013.01); H01L 2221/68327 (2013.01); H01L 2221/68381 (2013.01); H01L 2224/271 (2013.01); H01L 2224/27003 (2013.01); H01L 2224/2919 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/83885 (2013.01); H01L 2224/92 (2013.01); H01L 2224/94 (2013.01);
Abstract

The present invention relates to a dicing film including: a substrate film; and a cohesive layer, wherein a storage modulus of the cohesive layer at 30° C. is 3*10to 4*10Pa, and the cohesive layer has a degree of cross-linking of 80% to 99%, a dicing die-bonding film including the dicing film, and a dicing method of a semiconductor wafer using the dicing die-bonding film.

Find Patent Forward Citations

Kim, Se. (2017). Dicing film and dicing die-bonding film (U.S. Patent No. 9761476). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9761476

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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