The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 12, 2017

Filed:

May. 07, 2014
Applicant:

Toshiba Memory Corporation, Minato-ku, JP;

Inventors:

Yoshihiro Ogawa, Yokkaichi, JP;

Hajime Onoda, Kawasaki, JP;

Hiroshi Kawamoto, Kamakura, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/67 (2006.01); B08B 3/02 (2006.01); C11D 11/00 (2006.01); H01L 21/02 (2006.01);
U.S. Cl.
CPC ...
H01L 21/67028 (2013.01); B08B 3/022 (2013.01); C11D 11/0047 (2013.01); H01L 21/02057 (2013.01);
Abstract

A cleaning apparatus for a semiconductor substrate includes a belt conveyor, a treatment head that executes cleaning, rinsing and drying treatments, a rinse water supplying mechanism that supplies rinse water adjusted to a predetermined pH value to the treatment head and configured to rinse the substrate applies heat to the rinse water to set a rinse water temperature to 70° or above, and an optical mechanism. The treatment head is configured to rinse the substrate. The optical mechanism is configured to recognize a pattern on the semiconductor substrate so that the semiconductor substrate can be automatically placed on the belt conveyor with a direction of the recognized pattern and a feeding direction of the belt conveyor having a predetermined relationship. The treatment head includes a drying treatment mechanism configured to execute both a drying treatment with use of drying solvent and lamp annealing in execution of drying treatment.


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