The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 12, 2017

Filed:

Mar. 07, 2014
Applicant:

Applied Materials, Inc., Santa Clara, CA (US);

Inventors:

Andrew Nguyen, San Jose, CA (US);

Bradley Howard, Pleasanton, CA (US);

Shahid Rauf, Pleasanton, CA (US);

Ajit Balakrishna, Sunnyvale, CA (US);

Tom K. Cho, Los Altos, CA (US);

Kenneth S. Collins, San Jose, CA (US);

Anand Kumar, Bangalore, IN;

Michael D. Willwerth, Campbell, CA (US);

Yogananda Sarode Vishwanath, Bangalore, IN;

Assignee:

APPLIED MATERIALS, INC., Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B01D 45/00 (2006.01); H01J 37/32 (2006.01); B01D 45/08 (2006.01); B32B 1/02 (2006.01); B29C 65/00 (2006.01);
U.S. Cl.
CPC ...
H01J 37/32495 (2013.01); H01J 37/32449 (2013.01); H01J 37/32477 (2013.01); H01J 37/32871 (2013.01); B01D 45/08 (2013.01); B29C 66/71 (2013.01); B32B 1/02 (2013.01); Y10T 428/13 (2015.01);
Abstract

Embodiments of the present disclosure generally provide various apparatus and methods for reducing particles in a semiconductor processing chamber. One embodiment of present disclosure provides a vacuum screen assembly disposed over a vacuum port to prevent particles generated by the vacuum pump from entering substrate processing regions. Another embodiment of the present disclosure provides a perforated chamber liner around a processing region of the substrate. Another embodiment of the present disclosure provides a gas distributing chamber liner for distributing a cleaning gas around the substrate support under the substrate supporting surface.


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