The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9760002 B1

PDF
Full Text
Expired
Date of Patent:
Sep. 12, 2017

Filed:

Nov. 24, 2015
Applicant:

International Business Machines Corporation, Armonk, NY (US);

Inventors:

Hiroyuki Mori, Kawasaki, JP;

Hirokazu Noma, Kawasaki, JP;

Keishi Okamoto, Kawasaki, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G03F 7/26 (2006.01); G03F 7/00 (2006.01); G03F 7/38 (2006.01); H05K 3/42 (2006.01); H05K 3/46 (2006.01);
U.S. Cl.
CPC ...
G03F 7/0035 (2013.01); G03F 7/38 (2013.01); H05K 3/428 (2013.01); H05K 3/4679 (2013.01); H05K 2201/09509 (2013.01); H05K 2201/09563 (2013.01); H05K 2201/09845 (2013.01); H05K 2203/0577 (2013.01); H05K 2203/0588 (2013.01); H05K 2203/1453 (2013.01);
Abstract

A method of forming a circuit board includes forming a conductive pattern on a substrate; forming a first negative resist on the substrate after formation of the conductive pattern; partially exposing the first negative resist on the surface of the conductive pattern to form a first via exposure portion; forming a second negative resist on the substrate after formation of the first via exposure portion; partially exposing the second negative resist on the first via exposure portion to form a second via exposure portion larger than the first via exposure portion; developing the first negative resist and the second negative resist after formation of the second via exposure portion to form a via opening reaching the conductive pattern; and filling the via opening with a conductive material.


Find Patent Forward Citations

Mori, Hiroyuki. (2017). Circuit board formation using organic substrates (U.S. Patent No. 9760002). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9760002

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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