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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9758694 B1

PDFFull Text
Date of Patent:
Sep. 12, 2017

Filed:

Jan. 26, 2016

Curable resin composition, cured product thereof, and semiconductor device using the same

Applicant:

Central Glass Company, Limited, Ube-Shi, Yamaguchi, JP;

Inventors:

Masafumi Oda, Saitama, JP;

Junya Nakatsuji, Saitama, JP;

Yutaka Sugita, Saitama, JP;

Tsuyoshi Ogawa, Saitama, JP;

Assignee:

Central Glass Company, Limited, Ube-shi, JP;

Attorney:

Crowell & Moring LLP

Primary Examiner:

Marc Zimmer

Int. Cl.
CPC ...
C09D 183/04 (2006.01); H01L 23/29 (2006.01); C08K 3/36 (2006.01); C08G 77/04 (2006.01); C08G 77/00 (2006.01); H01L 21/56 (2006.01); H01L 23/495 (2006.01); C08G 77/16 (2006.01); C08G 77/18 (2006.01); H01L 23/31 (2006.01);
U.S. Cl.
CPC ...
C09D 183/04 (2013.01); C08G 77/04 (2013.01); C08G 77/16 (2013.01); C08G 77/18 (2013.01); C08G 77/80 (2013.01); C08K 3/36 (2013.01); H01L 21/56 (2013.01); H01L 23/295 (2013.01); H01L 23/296 (2013.01); H01L 23/49562 (2013.01); H01L 23/3121 (2013.01); H01L 23/4952 (2013.01); H01L 23/49503 (2013.01); H01L 23/49568 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/48247 (2013.01); H01L 2224/73265 (2013.01); H01L 2924/0002 (2013.01); H01L 2924/19107 (2013.01);
Abstract

According to one aspect of the present invention, there is provided a curable resin composition including at least: a polysiloxane compound having, in a molecule thereof, at least two functional groups selected from the group consisting of silanol groups and alkoxysilyl groups as a component (A-1); and silica whose extract water has a pH of 6.1 or lower at 25° C. as a component (B), wherein the amount of the component (B) relative to the total amount of the components (A-1) and (B) is in a range of 70 to 97 mass %. This curable resin composition is able to, even when formed into various shapes and sizes, prevent foaming during curing and thus is suitable as an encapsulant material for a semiconductor element.

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