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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9758372 B1

PDFFull Text
Date of Patent:
Sep. 12, 2017

Filed:

Feb. 13, 2013

Mems package with mems die, magnet, and window substrate fabrication method and structure

Applicant:

Amkor Technology, Inc., Chandler, AZ (US);

Inventors:

Bob Shih-Wei Kuo, Chandler, AZ (US);

Shaun Michael Bowers, Gilbert, AZ (US);

Russell Scott Shumway, Mesa, AZ (US);

Assignee:

AMKOR TECHNOLOGY, INC., Tempe, AZ (US);

Attorney:

McAndrews, Held & Malloy, Ltd.

Primary Examiner:

Kimberly Rizkallah

Assistant Examiner:

Dilinh Nguyen

Int. Cl.
CPC ...
H01L 23/02 (2006.01); H01L 23/34 (2006.01); H01L 23/04 (2006.01); H01L 23/48 (2006.01); H01L 23/52 (2006.01); H01L 29/40 (2006.01); B81C 1/00 (2006.01); B81B 7/00 (2006.01);
U.S. Cl.
CPC ...
B81C 1/00333 (2013.01); B81B 7/0077 (2013.01);
Abstract

A method includes mounting a window substrate to a carrier tape. The window substrate has a window extending between an upper surface of the window substrate and a lower surface of the window substrate, the carrier tape sealing the window at the lower surface. Bond pads on an active surface of a MEMS die are flip chip mounted to terminals on the upper surface of the window substrate, a MEMS active area of the MEMS die being aligned with the window of the window substrate. A magnet is mounted to an inactive surface of the MEMS die.

Find Patent Forward Citations

Kuo, Bob Shih-Wei. (2017). Mems package with mems die, magnet, and window substrate fabrication method and structure (U.S. Patent No. 9758372). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9758372

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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