The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 05, 2017
Filed:
Nov. 04, 2013
Applicant:
Infineon Technologies Ag, Neubiberg, DE;
Inventors:
Alexander Heinrich, Regensburg, DE;
Peter Scherl, Regensburg, DE;
Magdalena Hoier, Seubersdorf, DE;
Hans-Joerg Timme, Ottobrunn, DE;
Assignee:
Infineon Technologies AG, Neubiberg, DE;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 7/10 (2006.01); H05K 7/12 (2006.01); H05K 1/11 (2006.01); H05K 1/14 (2006.01); H01L 23/00 (2006.01); H05K 3/36 (2006.01); H05K 3/32 (2006.01); H05K 3/40 (2006.01);
U.S. Cl.
CPC ...
H05K 1/11 (2013.01); H01L 24/45 (2013.01); H01L 24/46 (2013.01); H01L 24/48 (2013.01); H01L 24/49 (2013.01); H01L 24/85 (2013.01); H05K 1/111 (2013.01); H05K 1/14 (2013.01); H01L 2224/45015 (2013.01); H01L 2224/45028 (2013.01); H01L 2224/4554 (2013.01); H01L 2224/45124 (2013.01); H01L 2224/45139 (2013.01); H01L 2224/45144 (2013.01); H01L 2224/45147 (2013.01); H01L 2224/45184 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48092 (2013.01); H01L 2224/48137 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/48465 (2013.01); H01L 2224/48507 (2013.01); H01L 2224/48511 (2013.01); H01L 2224/85 (2013.01); H01L 2224/85181 (2013.01); H01L 2224/85205 (2013.01); H01L 2224/85207 (2013.01); H01L 2924/00014 (2013.01); H01L 2924/13055 (2013.01); H01L 2924/181 (2013.01); H05K 3/32 (2013.01); H05K 3/36 (2013.01); H05K 3/4015 (2013.01); H05K 2201/04 (2013.01); H05K 2203/0285 (2013.01); Y10T 29/49126 (2015.01);
Abstract
An electronic device may comprise a semiconductor element and a wire bond connecting the semiconductor element to a substrate. Using a woven bonding wire may improve the mechanical and electrical properties of the wire bond. Furthermore, there may be a cost benefit. Woven bonding wires may be used in any electronic device, for example in power devices or integrated logic devices.