The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 05, 2017

Filed:

Sep. 08, 2016
Applicant:

Skyworks Solutions, Inc., Woburn, MA (US);

Inventors:

Peter J. Zampardi, Jr., Newbury Park, CA (US);

Hsiang-Chih Sun, Thousand Oaks, CA (US);

Hong Shen, Palo Alto, CA (US);

Mehran Janani, Oak Park, CA (US);

Jens Albrecht Riege, Ojai, CA (US);

Assignee:

Skyworks Solutions, Inc., Woburn, MA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H03F 3/213 (2006.01); H03F 3/19 (2006.01); H03F 1/02 (2006.01); H03F 3/21 (2006.01); H03F 3/195 (2006.01); H03F 3/24 (2006.01); H01L 23/522 (2006.01); H01L 23/66 (2006.01); H01L 23/00 (2006.01); H01L 29/36 (2006.01); H01L 29/66 (2006.01); H01L 29/737 (2006.01); H01L 29/812 (2006.01); H01L 29/08 (2006.01); H01L 29/205 (2006.01); H01L 21/8252 (2006.01); H01L 27/06 (2006.01); H01L 23/498 (2006.01); H01L 23/50 (2006.01); H03F 3/60 (2006.01); H01L 29/20 (2006.01); H01L 23/48 (2006.01); H01L 21/48 (2006.01); H01L 21/56 (2006.01); H01L 21/78 (2006.01); H01L 21/8249 (2006.01); H01L 21/66 (2006.01); H01L 23/31 (2006.01); H01L 21/768 (2006.01); H03F 3/187 (2006.01); H03F 3/347 (2006.01); H01L 29/8605 (2006.01); H01L 27/092 (2006.01); H03F 3/45 (2006.01); H01L 29/06 (2006.01); H01L 29/10 (2006.01);
U.S. Cl.
CPC ...
H03F 3/213 (2013.01); H01L 21/485 (2013.01); H01L 21/4853 (2013.01); H01L 21/4864 (2013.01); H01L 21/565 (2013.01); H01L 21/76898 (2013.01); H01L 21/78 (2013.01); H01L 21/8249 (2013.01); H01L 21/8252 (2013.01); H01L 22/14 (2013.01); H01L 23/3114 (2013.01); H01L 23/481 (2013.01); H01L 23/49811 (2013.01); H01L 23/49827 (2013.01); H01L 23/49838 (2013.01); H01L 23/49844 (2013.01); H01L 23/49861 (2013.01); H01L 23/49866 (2013.01); H01L 23/50 (2013.01); H01L 23/522 (2013.01); H01L 23/66 (2013.01); H01L 24/48 (2013.01); H01L 24/49 (2013.01); H01L 24/85 (2013.01); H01L 24/97 (2013.01); H01L 27/0605 (2013.01); H01L 27/0623 (2013.01); H01L 29/0821 (2013.01); H01L 29/0826 (2013.01); H01L 29/20 (2013.01); H01L 29/205 (2013.01); H01L 29/36 (2013.01); H01L 29/66242 (2013.01); H01L 29/7371 (2013.01); H01L 29/812 (2013.01); H03F 1/0205 (2013.01); H03F 3/19 (2013.01); H03F 3/195 (2013.01); H03F 3/21 (2013.01); H03F 3/245 (2013.01); H03F 3/60 (2013.01); H01L 23/49894 (2013.01); H01L 24/45 (2013.01); H01L 27/092 (2013.01); H01L 29/0684 (2013.01); H01L 29/1004 (2013.01); H01L 29/66863 (2013.01); H01L 29/737 (2013.01); H01L 29/8605 (2013.01); H01L 2223/665 (2013.01); H01L 2223/6611 (2013.01); H01L 2223/6616 (2013.01); H01L 2223/6644 (2013.01); H01L 2223/6655 (2013.01); H01L 2224/45015 (2013.01); H01L 2224/45139 (2013.01); H01L 2224/45144 (2013.01); H01L 2224/45147 (2013.01); H01L 2224/48177 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/48465 (2013.01); H01L 2224/48611 (2013.01); H01L 2224/48644 (2013.01); H01L 2224/48647 (2013.01); H01L 2224/48655 (2013.01); H01L 2224/48664 (2013.01); H01L 2224/48811 (2013.01); H01L 2224/48816 (2013.01); H01L 2224/48844 (2013.01); H01L 2224/48847 (2013.01); H01L 2224/48855 (2013.01); H01L 2224/48864 (2013.01); H01L 2224/4903 (2013.01); H01L 2224/49111 (2013.01); H01L 2224/49176 (2013.01); H01L 2224/85205 (2013.01); H01L 2224/85207 (2013.01); H01L 2224/85411 (2013.01); H01L 2224/85416 (2013.01); H01L 2224/85444 (2013.01); H01L 2224/85455 (2013.01); H01L 2224/85464 (2013.01); H01L 2924/10253 (2013.01); H01L 2924/10329 (2013.01); H01L 2924/12033 (2013.01); H01L 2924/12042 (2013.01); H01L 2924/1305 (2013.01); H01L 2924/1306 (2013.01); H01L 2924/13051 (2013.01); H01L 2924/13091 (2013.01); H01L 2924/1421 (2013.01); H01L 2924/15747 (2013.01); H01L 2924/181 (2013.01); H01L 2924/19105 (2013.01); H01L 2924/19107 (2013.01); H01L 2924/3011 (2013.01); H01L 2924/3025 (2013.01); H01L 2924/30111 (2013.01); H03F 3/187 (2013.01); H03F 3/347 (2013.01); H03F 3/45 (2013.01); H03F 2200/387 (2013.01); H03F 2200/451 (2013.01); H03F 2200/48 (2013.01); H03F 2200/555 (2013.01);
Abstract

One aspect of this disclosure is a power amplifier module that includes a power amplifier configured to amplify a radio frequency (RF) signal and tantalum nitride terminated through wafer via. The power amplifier includes a heterojunction bipolar transistor and a p-type field effect transistor, in which a semiconductor portion of the p-type field effect transistor corresponds to a channel includes the same type of semiconductor material as a collector layer of the heterojunction bipolar transistor. A metal layer in the tantalum nitride terminated through wafer via is included in an electrical connection between the power amplifier on a front side of a substrate and a conductive layer on a back side of the substrate. Other embodiments of the module are provided along with related methods and components thereof.


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