The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 05, 2017

Filed:

Jun. 25, 2015
Applicant:

Intel Corporation, Santa Clara, CA (US);

Inventors:

Xiang Li, Portland, OR (US);

Yun Ling, Portland, OR (US);

Chung-Hao J. Chen, Portland, OR (US);

Hao-Han Hsu, Portland, OR (US);

Shyamjith Mohan, Hillsboro, OR (US);

Kuan-Yu Chen, Hillsboro, OR (US);

Assignee:

INTEL CORPORATION, Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01R 12/00 (2006.01); H01R 12/70 (2011.01); H01R 13/6585 (2011.01); H01R 12/79 (2011.01); H01R 13/6592 (2011.01); H01R 12/77 (2011.01); H01R 12/59 (2011.01); H01R 12/88 (2011.01);
U.S. Cl.
CPC ...
H01R 12/7076 (2013.01); H01R 12/7011 (2013.01); H01R 12/774 (2013.01); H01R 12/79 (2013.01); H01R 13/6585 (2013.01); H01R 13/6592 (2013.01); H01R 12/594 (2013.01); H01R 12/775 (2013.01); H01R 12/88 (2013.01);
Abstract

A retention apparatus for a shielded cable is described. In one embodiment, the apparatus comprises a substrate having a ground; a connector coupled to the substrate; a cable shielded with a conductive material and having an end connectable to the connector to electrically connect with the connector; an electrically conductive material coupled to the ground of the substrate; and a grounding retention mechanism to cause the electrically conductive material to electrically connect the cable to the ground of the substrate by applying a force to the cable shield.


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