The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 05, 2017
Filed:
Apr. 10, 2015
Applicants:
Ki-tae Park, Seongnam-si, KR;
Kang-wook Lee, Suwon-si, KR;
Young-don Choi, Seoul, KR;
Yun-sang Lee, Yongin-si, KR;
Inventors:
Ki-Tae Park, Seongnam-si, KR;
Kang-Wook Lee, Suwon-si, KR;
Young-Don Choi, Seoul, KR;
Yun-Sang Lee, Yongin-si, KR;
Assignee:
Samsung Electronics Co., Ltd., Suwon-si, Gyeonggi-do, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01); H01L 25/065 (2006.01); H01L 23/64 (2006.01); G11C 5/06 (2006.01); H01L 23/34 (2006.01); H01L 23/538 (2006.01);
U.S. Cl.
CPC ...
H01L 25/0657 (2013.01); G11C 5/06 (2013.01); H01L 23/34 (2013.01); H01L 23/5384 (2013.01); H01L 23/64 (2013.01); H01L 24/17 (2013.01); H01L 2224/16 (2013.01); H01L 2224/1712 (2013.01); H01L 2225/06513 (2013.01); H01L 2225/06541 (2013.01); H01L 2225/06562 (2013.01); H01L 2225/06589 (2013.01); H01L 2225/1058 (2013.01); H01L 2924/09701 (2013.01); H01L 2924/14 (2013.01); H01L 2924/1434 (2013.01); H01L 2924/19106 (2013.01);
Abstract
A stacked semiconductor apparatus and method of fabricating same are disclosed. The apparatus includes upper and lower semiconductor devices having a similar pattern of connection elements. When stacked connected the resulting plurality of semiconductor devices includes a serial connection path traversing the stack, and may also include parallel connection paths, back-side mounted large components, and vertical thermal conduits.