The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 05, 2017

Filed:

Oct. 05, 2015
Applicant:

Globalfoundries Inc., Grand Cayman, KY;

Inventors:

David J. West, Essex Junction, VT (US);

Charles H. Wilson, Essex Junction, VT (US);

Richard S. Graf, Gray, ME (US);

Assignee:

GLOBALFOUNDRIES INC., Grand Cayman, KY;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/48 (2006.01); H01L 23/52 (2006.01); H01L 29/40 (2006.01); H01L 23/00 (2006.01); H01L 21/768 (2006.01); H01L 21/48 (2006.01); H01L 21/60 (2006.01);
U.S. Cl.
CPC ...
H01L 24/17 (2013.01); H01L 21/4853 (2013.01); H01L 21/76885 (2013.01); H01L 24/15 (2013.01); H01L 24/90 (2013.01); H01L 2021/60022 (2013.01); H01L 2224/13027 (2013.01); H01L 2224/15 (2013.01); H01L 2224/16113 (2013.01); H01L 2224/16168 (2013.01); H01L 2224/1712 (2013.01); H01L 2224/81192 (2013.01); H01L 2224/90 (2013.01);
Abstract

Aspects of the present disclosure include integrated circuit (IC) structures with angled interconnect elements. An IC structure according to the present disclosure can include: an IC chip interconnect surface including a radially inner region positioned within a radially outer region; and a plurality of conductive pillars extending outward from the radially inner region of the IC chip interconnect surface, relative to a radial centerline axis of the radially inner region of the IC chip interconnect surface, wherein the radially inner region of the IC chip interconnect surface is free of conductive pillars thereon.


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