The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 05, 2017

Filed:

Mar. 07, 2016
Applicant:

Micron Technology, Inc., Boise, ID (US);

Inventors:

Yang Chao, Boise, ID (US);

Joseph L. Hess, Meridian, ID (US);

Keith E. Ypma, Boise, ID (US);

Kurt J. Bossart, Eagle, ID (US);

Assignee:

Micron Technology, Inc., Boise, ID (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G02F 1/1333 (2006.01); H01J 9/20 (2006.01); H01L 23/544 (2006.01); G06T 7/00 (2017.01); G06T 11/20 (2006.01); H01L 21/66 (2006.01); H01L 23/48 (2006.01); H01L 21/67 (2006.01); H01L 21/68 (2006.01); H01L 25/00 (2006.01); H01L 25/065 (2006.01);
U.S. Cl.
CPC ...
H01L 23/544 (2013.01); G06T 7/001 (2013.01); G06T 7/0042 (2013.01); G06T 11/20 (2013.01); H01L 21/67259 (2013.01); H01L 21/681 (2013.01); H01L 22/20 (2013.01); H01L 23/481 (2013.01); H01L 25/0657 (2013.01); H01L 25/50 (2013.01); G06T 2207/30148 (2013.01); H01L 2223/5442 (2013.01); H01L 2223/54426 (2013.01); H01L 2225/06513 (2013.01); H01L 2225/06517 (2013.01); H01L 2225/06541 (2013.01);
Abstract

A method of determining a lateral misregistration between levels of a semiconductor structure comprises imaging at least one first alignment mark in a first level of the structure and at least one second alignment mark in a second level of the structure. A digital image of the first and second alignment marks is formed, each of which are defined by a set of points having an x-value and a y-value. The x-values and y-values of points defining the first alignment mark and points defining the second alignment mark are averaged to determine a center of the first alignment mark and a center of the second alignment mark. An x-coordinate and a y-coordinate of the center of the first alignment mark is subtracted from the respective x-coordinate and y-coordinate of the center of the second alignment mark to determine a lateral misregistration between the first level and the second level. Related methods of forming a semiconductor wafer, semiconductor assembles and metrology tools for use in implementing the methods are disclosed.


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