The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 05, 2017
Filed:
Sep. 16, 2015
Applicant:
Taiwan Semiconductor Manufacturing Company Limited, Hsinchu, TW;
Inventor:
I-Shuo Liu, Hsinchu, TW;
Assignee:
Taiwan Semiconductor Manufacturing Company Limited, Hsinchu, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/304 (2006.01); H01L 21/66 (2006.01); B24B 37/013 (2012.01); H01L 21/3105 (2006.01);
U.S. Cl.
CPC ...
H01L 22/24 (2013.01); B24B 37/013 (2013.01); H01L 21/31053 (2013.01); H01L 22/14 (2013.01); H01L 22/26 (2013.01);
Abstract
A method includes performing a chemical-mechanical planarization (CMP) on an article, providing a polishing fluid capable of transferring charges to the article, and detecting a current generated in response to the charges transferred to the article. An apparatus that is capable of performing the method and a system that includes the apparatus are also disclosed.