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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9754811 B1

PDFFull Text
Expired
Date of Patent:
Sep. 05, 2017

Filed:

Aug. 22, 2013

Dicing sheet with protective film forming layer and method for producing chip

Applicant:

Lintec Corporation, Tokyo, JP;

Inventors:

Naoya Saeki, Tokyo, JP;

Tomonori Shinoda, Tokyo, JP;

Ken Takano, Tokyo, JP;

Assignee:

LINTEC CORPORATION, Tokyo, JP;

Attorney:

Nixon & Vanderhye P.C.

Primary Examiner:

Caridad Everhart

Assistant Examiner:

Ankush Singal

Int. Cl.
CPC ...
H01L 21/68 (2006.01); H01L 21/683 (2006.01); C09J 163/00 (2006.01); C09J 7/02 (2006.01); H01L 21/78 (2006.01); H01L 23/544 (2006.01);
U.S. Cl.
CPC ...
H01L 21/6836 (2013.01); C09J 7/0228 (2013.01); C09J 7/0246 (2013.01); C09J 163/00 (2013.01); H01L 21/78 (2013.01); C09J 2203/326 (2013.01); C09J 2433/00 (2013.01); H01L 23/544 (2013.01); H01L 2221/6834 (2013.01); H01L 2221/68327 (2013.01); H01L 2221/68336 (2013.01); H01L 2221/68377 (2013.01); H01L 2223/54433 (2013.01); H01L 2223/54486 (2013.01); H01L 2924/0002 (2013.01); Y10T 428/1471 (2015.01);
Abstract

[Problem] To provide a dicing sheet that is with a protective film formation layer, can easily produce a semiconductor chip having a protective film having high uniformity and superior printing precision, is such that the peeling of the protective film and the dicing sheet can be easily performed, and has superior affixing ability of chips during dicing. [Solution] The dicing sheet with a protective film formation layer is characterized by a protective film formation layer being peelably provided on the adhesive layer of an adhesive sheet resulting from the adhesive layer, which contains an adhesive component and a free epoxy group-containing compound, being laminated onto a substrate film.

Find Patent Forward Citations

Saeki, Naoya. (2017). Dicing sheet with protective film forming layer and method for producing chip (U.S. Patent No. 9754811). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9754811

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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