The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 05, 2017

Filed:

Nov. 26, 2014
Applicant:

Korloy Inc., Seoul, KR;

Inventors:

Jae Hoon Kang, Cheongju-si, KR;

Dong Youl Lee, Cheongju-si, KR;

Jung Wook Kim, Cheongju-si, KR;

Han Sung Kim, Cheongju-si, KR;

Sung Gu Lee, Cheongju-si, KR;

Jin Woo Ahn, Cheongju-si, KR;

Sun Yong Ahn, Cheongju-si, KR;

Assignee:

KORLOY INC., Seoul, KR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C23C 16/06 (2006.01); C23C 28/04 (2006.01); C23C 16/44 (2006.01); C09D 1/00 (2006.01);
U.S. Cl.
CPC ...
C23C 16/06 (2013.01); C09D 1/00 (2013.01); C23C 16/44 (2013.01); C23C 28/044 (2013.01); C23C 28/048 (2013.01);
Abstract

Disclosed is an alpha alumina (α-Al2O3) thin film comprising the lower layer formed on the base material made from cemented carbide; and the α-Al2O3 thin film layer formed on the lower layer, wherein when the α-Al2O3 thin film layer is divided, from the total thickness (T) thereof, into a D1 layer which is from an interface layer to 0.15T, a D2 layer which is from 0.15T to 0.4T, and a D3 layer which is from 0.4T to 1T, an S1 (D3 layer grain size/D1 layer grain size) is 2-5.5 and an S2 (D2 layer grain size/D1 layer grain size) is 1.5-4.


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