The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 29, 2017
Filed:
Oct. 11, 2016
Applicant:
Murata Manufacturing Co., Ltd., Nagaokakyo-shi, Kyoto-fu, JP;
Inventor:
Yuji Toyota, Nagaokakyo, JP;
Assignee:
Murata Manufacturing Co., Ltd., Kyoto, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/48 (2006.01); H01L 23/00 (2006.01); H01L 23/31 (2006.01); H01L 23/29 (2006.01); H01L 21/60 (2006.01);
U.S. Cl.
CPC ...
H01L 24/17 (2013.01); H01L 23/29 (2013.01); H01L 23/31 (2013.01); H01L 23/3107 (2013.01); H01L 2021/60022 (2013.01); H01L 2224/1703 (2013.01); H01L 2224/175 (2013.01); H01L 2924/141 (2013.01); H01L 2924/142 (2013.01);
Abstract
An electronic device includes a mount board, first and second electronic components flip-chip mounted on a surface of the mount board with bumps interposed therebetween, and a sealing member that seals the first and second electronic components on the mount board. A thickness of the first electronic component is larger than a thickness of the second electronic component, and a height of the bump bonded to the first electronic component is smaller than a height of the bump bonded to the second electronic component.