The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 29, 2017
Filed:
Jul. 28, 2015
Applicant:
Samsung Electro-mechanics Co., Ltd., Suwon-si, KR;
Inventors:
Do Jae Yoo, Suwon-si, KR;
Kyu Hwan Oh, Suwon-si, KR;
Jong In Ryu, Suwon-si, KR;
Jae Hyun Lim, Suwon-si, KR;
Assignee:
Samsung Electro-Mechanics Co., Ltd., Suwon-si, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/00 (2006.01); H01L 23/552 (2006.01); H01L 21/56 (2006.01); H01L 25/00 (2006.01); H01L 25/065 (2006.01); H01L 23/498 (2006.01); H01L 23/31 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 23/552 (2013.01); H01L 21/561 (2013.01); H01L 23/3128 (2013.01); H01L 23/49811 (2013.01); H01L 23/49827 (2013.01); H01L 24/97 (2013.01); H01L 25/0657 (2013.01); H01L 25/50 (2013.01); H01L 23/49822 (2013.01); H01L 24/16 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/97 (2013.01); H01L 2225/06517 (2013.01); H01L 2225/06541 (2013.01); H01L 2225/06555 (2013.01); H01L 2924/15311 (2013.01); H01L 2924/19105 (2013.01); H01L 2924/3025 (2013.01);
Abstract
The package includes: a substrate having at least one circuit layer; at least one electronic component mounted on at least one surface of the substrate; a molded part formed on the surface of the substrate to enclose the electronic component; at least one via formed in the molded part to be electrically connected to the circuit layer of the substrate; and a pattern connected to one end of a plated tail connected to the circuit layer connected to the via and exposed to the exterior of the substrate.