The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 29, 2017
Filed:
Aug. 08, 2016
Applicant:
Semiconductor Components Industries, Llc, Phoenix, AZ (US);
Inventors:
Soon Wei Wang, Seremban, MY;
How Kiat Liew, Bukit Jalil, MY;
Chee Hiong Chew, Seremban, MY;
Francis J. Carney, Mesa, AZ (US);
Assignee:
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC, Phoenix, AZ (US);
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/495 (2006.01); H01L 21/48 (2006.01); H01L 21/56 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49503 (2013.01); H01L 21/4853 (2013.01); H01L 21/4867 (2013.01); H01L 21/565 (2013.01); H01L 23/4952 (2013.01); H01L 23/49558 (2013.01);
Abstract
A chip package, in some embodiments, comprises: a die flag; one or more die supports; and a die mounted on the die flag and on said one or more die supports, at least one surface of said die having an area larger than an area of at least one surface of the die flag.