The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 29, 2017

Filed:

Feb. 23, 2015
Applicant:

Shin-etsu Handotai Co., Ltd., Tokyo, JP;

Inventors:

Tsuyoshi Ohtsuki, Annaka, JP;

Hiroshi Takeno, Annaka, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/66 (2006.01); H01L 21/324 (2006.01); G01N 23/225 (2006.01); H01L 21/265 (2006.01); H01L 21/268 (2006.01); H01L 21/322 (2006.01);
U.S. Cl.
CPC ...
H01L 22/24 (2013.01); G01N 23/2254 (2013.01); H01L 21/2686 (2013.01); H01L 21/26513 (2013.01); H01L 21/322 (2013.01); H01L 21/324 (2013.01); G01N 2223/3106 (2013.01); G01N 2223/6116 (2013.01);
Abstract

The present invention provides a method for evaluating a semiconductor substrate subjected to a defect recovery heat treatment to recover a crystal defect in the semiconductor substrate having the crystal defect, flash lamp annealing is performed as the defect recovery heat treatment, and the method includes steps of measuring the crystal defect in the semiconductor substrate, which is being recovered, by controlling treatment conditions for the flash lamp annealing and analyzing a recovery mechanism of the crystal defect on the basis of a result of the measurement. Consequently, the method for evaluating a semiconductor substrate which enables evaluating a recovery process of the crystal defect is provided.


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