The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 29, 2017
Filed:
Jun. 16, 2015
Applicant:
Toshiba Memory Corporation, Minato-ku, JP;
Inventors:
Shinichi Hirasawa, Mie, JP;
Dai Fukushima, Kuwana, JP;
Assignee:
TOSHIBA MEMORY CORPORATION, Minato-ku, JP;
Primary Examiner:
Int. Cl.
CPC ...
B24B 37/22 (2012.01); H01L 21/02 (2006.01); H01L 21/306 (2006.01); B24B 37/24 (2012.01); H01L 21/67 (2006.01);
U.S. Cl.
CPC ...
H01L 21/02057 (2013.01); B24B 37/24 (2013.01); H01L 21/30625 (2013.01); H01L 21/67046 (2013.01);
Abstract
A semiconductor manufacturing apparatus according to an embodiment includes a first cleaner and a second cleaner. The first cleaner polishes a semiconductor substrate or a polishing target material on the semiconductor substrate with an abrasive and then cleans a top face of the semiconductor substrate or of the polishing target material while the semiconductor substrate is rotated. The second cleaner rubs an end portion of the semiconductor substrate with a physical contact according to rotation of the semiconductor substrate.