The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 29, 2017

Filed:

Aug. 06, 2013
Applicant:

Kemet Electronics Corporation, Simpsonville, SC (US);

Inventors:

Antony P. Chacko, Simpsonville, SC (US);

John E. McConnell, Simpsonville, SC (US);

Robert Ramsbottom, Simpsonville, SC (US);

Philip M. Lessner, Simpsonville, SC (US);

Randolph S. Hahn, Simpsonville, SC (US);

John Bultitude, Simpsonville, SC (US);

Assignee:

KEMET Electronics Corporation, Simpsonville, SC (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01G 9/048 (2006.01); H01G 9/00 (2006.01); H01G 9/012 (2006.01); H01G 11/26 (2013.01); H01G 9/04 (2006.01); H01G 9/042 (2006.01);
U.S. Cl.
CPC ...
H01G 9/048 (2013.01); H01G 9/0029 (2013.01); H01G 9/012 (2013.01); H01G 9/04 (2013.01); H01G 9/0425 (2013.01); H01G 11/26 (2013.01); Y10T 29/417 (2015.01);
Abstract

A solid electrolytic capacitor is described which comprises an anode, a dielectric on the anode and a cathode on the dielectric. A conductive coating is on the cathode wherein the conductive layer comprises an exterior surface of a first high melting point metal. An adjacent layer is provided comprising a second high melting point metal, wherein the first high melting point metal and the second high melting point metal are metallurgically bonded with a low melting point metal.


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