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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9745464 B1

PDFFull Text
Date of Patent:
Aug. 29, 2017

Filed:

Feb. 07, 2013

Halogen-free flame retardant resin composition and the use thereof

Applicant:

Shengyi Technology Co., Ltd., Guangdong, CN;

Inventors:

Yueshan He, Guangdong, CN;

Shiguo Su, Guangdong, CN;

Assignee:

SHENGYI TECHNOLOGY CO., LTD., Guangdong, CN;

Attorney:

McDonald Hopkins LLC

Primary Examiner:

Ian Rummel

Int. Cl.
CPC ...
C08L 63/00 (2006.01); H05K 1/03 (2006.01); C08L 71/00 (2006.01); B32B 15/092 (2006.01); C08J 5/24 (2006.01); B32B 15/16 (2006.01); B32B 27/20 (2006.01); C08G 59/50 (2006.01); C08G 59/62 (2006.01); C08L 61/06 (2006.01); H05K 3/02 (2006.01);
U.S. Cl.
CPC ...
C08L 63/00 (2013.01); B32B 15/092 (2013.01); B32B 15/16 (2013.01); B32B 27/20 (2013.01); C08G 59/50 (2013.01); C08G 59/621 (2013.01); C08J 5/24 (2013.01); C08L 71/00 (2013.01); H05K 1/0353 (2013.01); H05K 1/0373 (2013.01); B32B 2260/025 (2013.01); B32B 2260/046 (2013.01); B32B 2264/102 (2013.01); B32B 2264/104 (2013.01); B32B 2307/306 (2013.01); B32B 2457/08 (2013.01); C08J 2361/06 (2013.01); C08J 2363/00 (2013.01); C08L 61/06 (2013.01); H05K 1/0366 (2013.01); H05K 3/022 (2013.01); H05K 2201/012 (2013.01); H05K 2201/0209 (2013.01);
Abstract

The present invention relates to a halogen-free flame retardant resin composition, according to parts by weight, the resin composition comprises: (A) a mixture of phenoxyphosphazene compound (A1) and compound (A2) having a dihydrobenzoxazine ring, the mixture comprising 45-90 parts by weight, and the weight ratio of the phenoxyphosphazene compound (A1) and the compound (A2) having a dihydrobenzoxazine ring is between 1:25-1:2; (B) an epoxy resin with epoxy equivalent of 500-2000, the epoxy resin comprising 10-45 parts by weight; (C) a phenolic resin comprising 10-25 parts by weight; and (D) an amine curing agent comprising 0.5-10 parts by weight. The prepreg, laminate, and metal-clad laminate for the printed circuit prepared using the halogen-free flame retardant resin composition, have the advantages of high glass transition temperature (T), high thermal resistance, low dielectric dissipation factor, low water absorption as well as a low C.T.E.

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