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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9745411 B1

PDFFull Text
Date of Patent:
Aug. 29, 2017

Filed:

Jun. 26, 2014

Resin composition, resin sheet, cured resin sheet, resin sheet structure, cured resin sheet structure, method for producing cured resin sheet structure, semiconductor device, and led device

Applicant:

Hitachi Chemical Company, Ltd., Tokyo, JP;

Inventors:

Tomoo Nishiyama, Tokyo, JP;

Shigemitsu Yoshie, Tokyo, JP;

Naoki Hara, Tokyo, JP;

Kazumasa Fukuda, Tokyo, JP;

Atsushi Kuwano, Tokyo, JP;

Yasuo Miyazaki, Tokyo, JP;

Assignee:

Hitachi Chemical Company, Ltd., Tokyo, JP;

Attorney:

Fitch, Even, Tabin & Flannery, LLP

Primary Examiner:

Kenneth Parker

Assistant Examiner:

Warren H Kilpatrick

Int. Cl.
CPC ...
C08G 59/62 (2006.01); C08L 63/00 (2006.01); H01L 23/29 (2006.01); C08L 63/04 (2006.01); B32B 15/092 (2006.01); B32B 27/08 (2006.01); B32B 27/38 (2006.01); B32B 37/06 (2006.01); C08J 5/18 (2006.01); H01L 33/56 (2010.01); C08K 3/22 (2006.01); C08K 3/38 (2006.01);
U.S. Cl.
CPC ...
C08G 59/621 (2013.01); B32B 15/092 (2013.01); B32B 27/08 (2013.01); B32B 27/38 (2013.01); B32B 37/06 (2013.01); C08J 5/18 (2013.01); C08L 63/00 (2013.01); C08L 63/04 (2013.01); H01L 23/295 (2013.01); H01L 33/56 (2013.01); B32B 2305/72 (2013.01); B32B 2311/00 (2013.01); B32B 2363/00 (2013.01); B32B 2457/20 (2013.01); C08J 2363/04 (2013.01); C08K 2003/2227 (2013.01); C08K 2003/385 (2013.01); C08K 2201/003 (2013.01); C08L 2203/206 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/73265 (2013.01); H01L 2924/0002 (2013.01); H01L 2924/13055 (2013.01);
Abstract

A resin composition including an epoxy resin monomer, a novolac resin including a compound having a structural unit represented by Formula (I), and a filler; in which the filler has at least 4 peaks in a particle size distribution measured by laser diffractometry, in which four of the peaks are present respectively in ranges of not less than 0.01 μm and less than 1 μm, not less than 1 μm and less than 10 μm, from 10 μm to 50 μm, and from 20 μm to 100 μm, and in which a peak present in a range of from 10 μm to 50 μm includes an aluminum oxide particle, and a peak present in a range of from 20 μm to 100 μm includes a boron nitride particle. In Formula (I) each of R, Rand Rindependently represents a hydrogen atom, an alkyl group, or the like. m represents 0 to 2, and n represents 1 to 7.

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