The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 29, 2017
Filed:
Dec. 29, 2011
Minshe Su, Dongguan, CN;
Qianfa Liu, Dongguan, CN;
Minshe Su, Dongguan, CN;
Qianfa Liu, Dongguan, CN;
SHENGYI TECHNOLOGY CO., LTD., Guangdong, CN;
Abstract
Provided is a circuit substrate, including a glass film () forming a rough layer () after surface roughness processing, a resin adhesion () located the rough layer () on either side of the glass film (), and a metal foil () located on the outside of resin adhesion layer (). The glass film (), the resin adhesion layer () and the metal foil () are joined together through suppressing. The circuit substrate employs the glass film () which forms a rough layer () after surface roughness processing as a carrier material, so that the resin adhesion layer () and the surface of the glass film () have a good binding force, and the dielectric constant of the circuit substrate has slight difference in the directions of X, Y and Z. Also provided is manufacturing method for a circuit substrate.