The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 22, 2017
Filed:
Sep. 22, 2015
Applicant:
Intel Corporation, Santa Clara, CA (US);
Inventors:
Henry C. Bosak, Hillsboro, OR (US);
Thomas A. Boyd, North Plains, OR (US);
Harvey R. Kofstad, Vernonia, OR (US);
Assignee:
Intel Corporation, Santa Clara, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/427 (2006.01); H05K 7/20 (2006.01); H01L 23/40 (2006.01); H01L 23/473 (2006.01); H01L 25/065 (2006.01); H01L 23/367 (2006.01);
U.S. Cl.
CPC ...
H05K 7/20509 (2013.01); H01L 23/40 (2013.01); H01L 23/4006 (2013.01); H01L 23/427 (2013.01); H01L 23/473 (2013.01); H01L 25/0655 (2013.01); H05K 7/20336 (2013.01); H01L 23/3672 (2013.01); H01L 2924/1432 (2013.01); H01L 2924/1434 (2013.01); H01L 2924/1531 (2013.01);
Abstract
Embodiments of the present disclosure may include a heat removal assembly that is to thermally couple with two or more dice of an electronic device. The heat removal assembly may include a bellows to automatically adjust a position of at least one surface of the heat removal assembly relative to another surface of the heat removal assembly. Other embodiments may be described and/or claimed.