The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 22, 2017
Filed:
Aug. 27, 2015
Applicant:
Sumitomo Electric Device Innovations, Inc., Yokohama-shi, JP;
Inventors:
Ikuo Nakashima, Yokohama, JP;
Naoto Murata, Yokohama, JP;
Assignee:
Sumitomo Electric Device Innovations, Inc., Yokohama-shi, JP;
Primary Examiner:
Int. Cl.
CPC ...
H05K 7/20 (2006.01); H01L 23/055 (2006.01); H01L 23/367 (2006.01); H01L 23/498 (2006.01);
U.S. Cl.
CPC ...
H05K 7/205 (2013.01); H01L 23/055 (2013.01); H01L 23/3677 (2013.01); H01L 23/49827 (2013.01); H01L 23/49844 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48137 (2013.01); H01L 2224/48227 (2013.01); H03F 2200/447 (2013.01);
Abstract
An amplifier module having a surface-mounting carrier with a base and lid is disclosed. The base in a top surface thereof provides a die pad on which a transistor is mounted, and a back surface thereof provides a back pad electrically and thermally connected to the die pad. The back pad has an area wider than the area of the die pad. The heat conduction from the transistor to the host board on which the amplifier module is mounted is effectively enhanced.