The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 22, 2017

Filed:

Feb. 24, 2016
Applicant:

Intel Ip Corporation, Santa Clara, CA (US);

Inventors:

Klaus Reingruber, Langquaid, DE;

Sven Albers, Regensburg, DE;

Christian Geissler, Teugn, DE;

Assignee:

Intel IP Corportaion, Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01F 5/00 (2006.01); H01L 23/498 (2006.01); H01L 21/48 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49838 (2013.01); H01L 21/4846 (2013.01);
Abstract

Embodiments herein may relate to a package with a dielectric layer having a first face and a second face opposite the first face. A conductive line of a patterned metal redistribution layer (RDL) may be coupled with the second face of the dielectric layer. The line may include a first portion with a first width and a second portion directly coupled to the first portion, the second portion having a second width. The first portion may extend beyond a plane of the second face of the dielectric layer, and the second portion may be positioned between the first face and the second face of the dielectric layer. Other embodiments may be described and/or claimed.


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