The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 22, 2017
Filed:
Mar. 16, 2016
Applicant:
Cascade Microtech, Inc., Beaverton, OR (US);
Inventors:
Michael E. Simmons, Colton, OR (US);
Kazuki Negishi, Beaverton, OR (US);
Ryan Garrison, Beaverton, OR (US);
Philip Wolf, Aloha, OR (US);
Assignee:
Cascade Microtech, Inc., Beaverton, OR (US);
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/683 (2006.01); G01R 31/26 (2014.01); G01R 31/28 (2006.01);
U.S. Cl.
CPC ...
H01L 21/6838 (2013.01); G01R 31/2865 (2013.01); Y10T 279/11 (2015.01);
Abstract
A chuck for testing an integrated circuit includes an upper conductive layer having a lower surface and an upper surface suitable to support a device under test. An upper insulating layer has an upper surface at least in partial face-to-face contact with the lower surface of the upper conductive layer, and a lower surface. A middle conductive layer has an upper surface at least in partial face-to-face contact with the lower surface of the upper insulating layer, and a lower surface.