The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 22, 2017

Filed:

Jun. 27, 2016
Applicant:

Via Alliance Semiconductor Co., Ltd., Shanghai, CN;

Inventors:

G. Glenn Henry, Austin, TX (US);

Dinesh K. Jain, Austin, TX (US);

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
G06F 13/12 (2006.01); G06F 12/0875 (2016.01); G11C 17/16 (2006.01); G06F 3/06 (2006.01); G06F 9/44 (2006.01); G06F 9/445 (2006.01); G06F 12/06 (2006.01); G06F 12/0806 (2016.01); G11C 17/18 (2006.01); G11C 29/00 (2006.01); G06F 11/10 (2006.01); G06F 12/0802 (2016.01); G11C 29/52 (2006.01); G06F 12/128 (2016.01); G06F 1/24 (2006.01); G06F 12/084 (2016.01); G06F 12/0811 (2016.01);
U.S. Cl.
CPC ...
G06F 12/0875 (2013.01); G06F 1/24 (2013.01); G06F 3/0604 (2013.01); G06F 3/0619 (2013.01); G06F 3/0632 (2013.01); G06F 3/0638 (2013.01); G06F 3/0679 (2013.01); G06F 3/0688 (2013.01); G06F 9/4401 (2013.01); G06F 9/4403 (2013.01); G06F 9/4405 (2013.01); G06F 9/44505 (2013.01); G06F 11/1008 (2013.01); G06F 11/1068 (2013.01); G06F 12/0646 (2013.01); G06F 12/0692 (2013.01); G06F 12/0802 (2013.01); G06F 12/084 (2013.01); G06F 12/0806 (2013.01); G06F 12/0811 (2013.01); G06F 12/128 (2013.01); G11C 17/16 (2013.01); G11C 17/18 (2013.01); G11C 29/52 (2013.01); G11C 29/802 (2013.01); G06F 2212/1008 (2013.01); G06F 2212/1012 (2013.01); G06F 2212/1032 (2013.01); G06F 2212/283 (2013.01); G06F 2212/452 (2013.01); G06F 2212/453 (2013.01); G06F 2212/601 (2013.01); G06F 2212/62 (2013.01); G06F 2212/69 (2013.01);
Abstract

An apparatus includes a semiconductor fuse array, disposed on a semiconductor die, into which is programmed configuration data. The semiconductor fuse array has a first plurality of semiconductor fuses and a second plurality of semiconductor fuses. The first plurality of semiconductor fuses is configured to store the configuration data in an encoded and compressed format. The second plurality of semiconductor fuses is configured to store first fuse correction data that indicates locations and values corresponding to a first one or more fuses within the first plurality of fuses whose states are to be changed from that which was previously stored.


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