The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 22, 2017

Filed:

May. 12, 2014
Applicant:

Star Technologies, Inc., Hsinchu, TW;

Inventors:

Choon Leong Lou, Hsinchu, TW;

Hsiao Ting Tseng, Hsinchu, TW;

Ho Yeh Chen, Hsinchu, TW;

Li Min Wang, Hsinchu, TW;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G01R 1/04 (2006.01); G01R 31/28 (2006.01); G01R 1/073 (2006.01);
U.S. Cl.
CPC ...
G01R 31/2889 (2013.01); G01R 1/07342 (2013.01);
Abstract

A test assembly adapted to test a semiconductor device is provided. The test assembly includes a main circuit board, an intermediate dielectric board, an intermediate circuit board, a plurality of intermediate conductive elements and a plurality of test probes. The main circuit board includes a surface and a plurality of pads disposed on the surface. The intermediate dielectric board is detachably disposed on the surface of the main circuit board and includes a plurality of through holes. The intermediate circuit board is disposed on the intermediated dielectric board and includes a plurality of first pads, a plurality of second pads, a first surface and a second surface opposite to the first surface. The intermediate conductive elements are disposed in the through holes, respectively. Each of the intermediate conductive elements electrically connects one of the pads of the main circuit board and one of the first pads of the intermediate circuit board. The test probes are disposed on the second surface of the intermediate circuit board and respectively electrically connected to the second pads of the intermediate circuit board. Each of the test probes is electrically connected to the main circuit board through the intermediate circuit board and one of the intermediated conductive elements.


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