The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 22, 2017

Filed:

Feb. 06, 2013
Applicant:

Tyco Electronics Corporation, Berwyn, PA (US);

Inventors:

Chong Hun Yi, Mechanicsburg, PA (US);

Andrew Dewitt Balthaser, Dauphin, PA (US);

Brian Klinger, Harrisburg, PA (US);

Matt Richard McAlonis, Elizabethtown, PA (US);

Keith Miller, Manheim, PA (US);

Assignee:

TE CONNECTIVITY CORPORATION, Berwyn, PA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
F28F 3/02 (2006.01); H01L 23/367 (2006.01); H01L 23/373 (2006.01); H01L 23/40 (2006.01); H01L 23/427 (2006.01);
U.S. Cl.
CPC ...
F28F 3/02 (2013.01); H01L 23/367 (2013.01); H01L 23/373 (2013.01); H01L 23/40 (2013.01); H01L 23/427 (2013.01); H01L 2924/0002 (2013.01);
Abstract

A heat sink includes a frame having a non-metallic body that includes a window. The non-metallic body includes at least one peripheral wall that defines a boundary of the window. The non-metallic body includes a non-metallic material. The heat sink also includes a heat exchanger having a base and cooling fins. The base has a structure side and an opposite environmental side. The structure side of the base is configured to thermally communicate with a structure for absorbing heat from the structure. The cooling fins extend from the environmental side of the base. The heat exchanger is held by the frame such that the cooling fins extend within the window of the frame.


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