The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 22, 2017

Filed:

May. 24, 2016
Applicant:

International Business Machines Corporation, Armonk, NY (US);

Inventors:

Cyril Cabral, Jr., Mahopac, NY (US);

Fuad E. Doany, Katonah, NY (US);

Gregory M. Fritz, Wakefield, MA (US);

Michael S. Gordon, Yorktown Heights, NY (US);

Qiang Huang, Croton on Hudson, NY (US);

Eric P. Lewandowski, Morristown, NJ (US);

Xiao Hu Liu, Briarcliff Manor, NY (US);

Kenneth P. Rodbell, Sandy Hook, CT (US);

Thomas M. Shaw, Peekskill, NY (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C03C 17/06 (2006.01); C03C 15/00 (2006.01); C03C 23/00 (2006.01); C03B 23/203 (2006.01); G03F 7/20 (2006.01); C03C 17/34 (2006.01); C03C 21/00 (2006.01); C03C 27/06 (2006.01);
U.S. Cl.
CPC ...
C03C 17/06 (2013.01); C03B 23/203 (2013.01); C03C 15/00 (2013.01); C03C 17/34 (2013.01); C03C 21/002 (2013.01); C03C 23/0055 (2013.01); C03C 27/06 (2013.01); G03F 7/20 (2013.01); C03C 2217/252 (2013.01); C03C 2217/261 (2013.01); C03C 2218/32 (2013.01); C03C 2218/328 (2013.01); C03C 2218/34 (2013.01);
Abstract

A method of manufacturing a glass substrate to control the fragmentation characteristics by etching and filling trenches in the glass substrate is disclosed. An etching pattern may be determined. The etching pattern may outline where trenches will be etched into a surface of the glass substrate. The etching pattern may be configured so that the glass substrate, when fractured, has a smaller fragmentation size than chemically strengthened glass that has not been etched. A mask may be created in accordance with the etching pattern, and the mask may be applied to a surface of the glass substrate. The surface of the glass substrate may then be etched to create trenches. A filler material may be deposited into the trenches.


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