The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 15, 2017
Filed:
Mar. 02, 2016
Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;
Wen Chu Hsiao, Tainan, TW;
Lai Wan Chong, Kaohsiung, TW;
Chun-Chieh Wang, Kaohsiung, TW;
Ying Min Chou, Tainan, TW;
Hsiang Hsiang Ko, Sinying, TW;
Ying-Lang Wang, Tien-Chung Village, TW;
Abstract
A semiconductor device includes an isolation feature in a substrate. The semiconductor device further includes a first source/drain feature in the substrate, wherein a first side of the first source/drain feature contacts the isolation feature, and the first source/drain feature exposes a portion of the isolation feature below a top surface of the substrate. The semiconductor device further includes a silicide layer over the first source/drain feature. The semiconductor device further includes a dielectric layer along the exposed portion of the isolation feature below the top surface of the substrate, wherein the dielectric layer contacts the silicide layer. The semiconductor device further includes a second source/drain feature in the substrate on an opposite side of a gate stack from the first source/drain feature, wherein the second source/drain feature has a substantially uniform thickness.