The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 15, 2017

Filed:

May. 25, 2016
Applicant:

Toyota Jidosha Kabushiki Kaisha, Toyota-shi, Aichi-ken, JP;

Inventors:

Hiroki Miyake, Toyota, JP;

Tatsuji Nagaoka, Toyota, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/15 (2006.01); H01L 31/0312 (2006.01); H01L 27/06 (2006.01); H01L 29/78 (2006.01); H01L 29/872 (2006.01); H01L 29/16 (2006.01); H01L 29/36 (2006.01); H01L 29/40 (2006.01); H01L 29/06 (2006.01);
U.S. Cl.
CPC ...
H01L 27/0629 (2013.01); H01L 29/0619 (2013.01); H01L 29/0649 (2013.01); H01L 29/1608 (2013.01); H01L 29/36 (2013.01); H01L 29/407 (2013.01); H01L 29/7813 (2013.01); H01L 29/872 (2013.01);
Abstract

An SBD includes a semiconductor substrate; an anode electrode which is in Schottky contact with a front surface of the semiconductor substrate; and a cathode electrode which is in ohmic contact with a rear surface of the semiconductor substrate. A trench extending from the front surface of the semiconductor substrate toward the rear surface of the semiconductor substrate is provided in the semiconductor substrate, and an inner surface of the trench is covered with an insulating film. An insulating layer is deposited at a deep portion of the trench, and a conductive layer is deposited at a shallow portion of the trench. An n-type front surface region in contact with the anode electrode, an n-type rear surface region in contact with the cathode electrode, and an n-type intermediate region connecting the front surface region and the rear surface region are provided in the semiconductor substrate.


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