The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 15, 2017
Filed:
Jul. 25, 2016
Applicant:
Micron Technology, Inc., Boise, ID (US);
Inventor:
Tzung-Han Lee, Taipei, TW;
Assignee:
Micron Technology, Inc., Boise, ID (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01); H01L 21/66 (2006.01); H01L 23/544 (2006.01);
U.S. Cl.
CPC ...
H01L 24/03 (2013.01); H01L 22/32 (2013.01); H01L 23/544 (2013.01); H01L 24/06 (2013.01); H01L 24/43 (2013.01); H01L 24/46 (2013.01); H01L 24/85 (2013.01); H01L 2224/05567 (2013.01);
Abstract
In some embodiments, the present disclosure provides a conductive pads forming method. The conductive pads forming method may include providing a contact pad or a test pad electrically connected to a semiconductor component; and forming the conductive pads electrically connected to the contact pad or the test pad through the conductive routes, respectively.