The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 15, 2017

Filed:

Jan. 30, 2014
Applicant:

Fei Company, Hillsboro, OR (US);

Inventors:

Alexander Buxbaum, Portland, OR (US);

Michael Schmidt, Gresham, OR (US);

Assignee:

FEI Company, Hillsboro, OR (US);

Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/66 (2006.01); H01L 21/67 (2006.01); B28D 5/04 (2006.01); G03F 1/72 (2012.01); G03F 7/20 (2006.01); H01L 21/304 (2006.01); G01N 1/28 (2006.01); B26D 3/28 (2006.01); G03F 1/84 (2012.01);
U.S. Cl.
CPC ...
H01L 22/14 (2013.01); B26D 3/282 (2013.01); B28D 5/04 (2013.01); G01N 1/286 (2013.01); G03F 1/72 (2013.01); G03F 1/84 (2013.01); G03F 7/7065 (2013.01); G03F 7/70608 (2013.01); H01L 21/304 (2013.01); G01N 2001/2873 (2013.01); Y10T 156/1967 (2015.01);
Abstract

A method and apparatus for use in surface delayering for fault isolation and defect localization of a sample work piece is provided. More particularly, a method and apparatus for mechanically peeling of one or more layers from the sample in a rapid, controlled, and accurate manner is provided. A programmable actuator includes a delayering probe tip with a cutting edge that is shaped to quickly and accurately peel away a layer of material from a sample. The cutting face of the delayering probe tip is configured so that each peeling step peels away an area of material having a linear dimension substantially equal to the linear dimension of the delayering probe tip cutting face. The surface delayering may take place inside a vacuum chamber so that the target area of the sample can be observed in-situ with FIB/SEM imaging.


Find Patent Forward Citations

Loading…