The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 08, 2017
Filed:
Feb. 13, 2013
Curamik Electronics Gmbh, Eschenbach, DE;
Andreas Meyer, Wenzenbach, DE;
Christoph Wehe, Wenzenbach, DE;
Jürgen Schulz-Harder, Lauf, DE;
Karsten Schmidt, Eschenbach, DE;
ROGERS GERMANY GMBH, Eschenbach, DE;
Abstract
A metal-ceramic substrate having at least one ceramic layer (), which is provided on a first surface side () with at least one first metallization () and on a second surface side (), opposite from the first surface side (), with a second metallization (), wherein the first metallization () is formed by a film or layer of copper or a copper alloy and is connected to the first surface side () of the ceramic layer () with the aid of a 'direct copper bonding' process. The second metallization () is formed by a layer of aluminum or an aluminum alloy.