The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 08, 2017

Filed:

Jul. 22, 2015
Applicant:

Sumitomo Electric Industries, Ltd., Osaka-shi, JP;

Inventors:

Keiji Wada, Osaka, JP;

Taro Nishiguchi, Osaka, JP;

Toru Hiyoshi, Osaka, JP;

Taku Horii, Osaka, JP;

Kosuke Uchida, Osaka, JP;

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/739 (2006.01); H01L 29/78 (2006.01); H01L 29/12 (2006.01); H01L 21/04 (2006.01); H01L 29/10 (2006.01); H01L 29/16 (2006.01); H01L 29/49 (2006.01); H01L 21/02 (2006.01);
U.S. Cl.
CPC ...
H01L 29/7396 (2013.01); H01L 21/0262 (2013.01); H01L 21/02378 (2013.01); H01L 21/02433 (2013.01); H01L 21/02529 (2013.01); H01L 21/02576 (2013.01); H01L 21/0475 (2013.01); H01L 29/1095 (2013.01); H01L 29/12 (2013.01); H01L 29/1608 (2013.01); H01L 29/4916 (2013.01); H01L 29/7395 (2013.01); H01L 29/78 (2013.01); H01L 29/7802 (2013.01);
Abstract

A silicon carbide epitaxial layer includes: a first impurity region; a second impurity region; and a third impurity region. A gate insulating film is in contact with the first impurity region, the second impurity region, and the third impurity region. A groove portion is formed in a surface of the first impurity region, the surface being in contact with the gate insulating film, the groove portion extending in one direction along the surface, a width of the groove portion in the one direction being twice or more as large as a width of the groove portion in a direction perpendicular to the one direction, a maximum depth of the groove portion from the surface being not more than 10 nm.


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