The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 08, 2017
Filed:
Mar. 10, 2014
Invensas Corporation, San Jose, CA (US);
Belgacem Haba, Saratoga, CA (US);
Richard Dewitt Crisp, Hornitos, CA (US);
Wael Zohni, San Jose, CA (US);
Invensas Corporation, San Jose, CA (US);
Abstract
A microelectronic package () can include lower and upper package faces (), lower terminals () at the lower package face, upper terminals () at the upper package face, first and second microelectronic elements () each having memory storage array function, and conductive interconnects () each electrically connecting at least one lower terminal with at least one upper terminal. The conductive interconnects () can include first conductive interconnects () configured to carry address in formation, signal assignments of a first set () of the first interconnects having (180) rotational symmetry about a theoretical rotational axis () with signal assignments of a second set () of first interconnects. The conductive interconnects () can also include second conductive interconnects () configured to carry data information, the position of each second conductive interconnect having (180) rotational symmetry about the rotational axis () with a position of a corresponding no-connect conductive interconnect ().