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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9728487 B1

PDFFull Text
Date of Patent:
Aug. 08, 2017

Filed:

Apr. 09, 2016

Semiconductor device

Applicant:

Renesas Electronics Corporation, Tokyo, JP;

Inventors:

Takashi Karashima, Gunma, JP;

Yumi Imamura, Gunma, JP;

Yosuke Imazeki, Tokyo, JP;

Assignee:

RENESAS ELECTRONICS CORPORATION, Tokyo, JP;

Attorney:

McGinn IP Law Group, PLLC

Primary Examiner:

Calvin Lee

Int. Cl.
CPC ...
H01L 23/34 (2006.01); H01L 21/00 (2006.01); H01L 23/40 (2006.01); H01L 23/38 (2006.01); H01L 23/36 (2006.01); H01L 23/498 (2006.01); H01L 23/055 (2006.01); H01L 23/10 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 23/40 (2013.01); H01L 23/055 (2013.01); H01L 23/36 (2013.01); H01L 23/38 (2013.01); H01L 23/4093 (2013.01); H01L 23/49805 (2013.01); H01L 23/10 (2013.01); H01L 23/49816 (2013.01); H01L 23/49827 (2013.01); H01L 23/562 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/73265 (2013.01); H01L 2924/15174 (2013.01); H01L 2924/15184 (2013.01); H01L 2924/15311 (2013.01); H01L 2924/16195 (2013.01); H01L 2924/181 (2013.01);
Abstract

An object of the present invention is to improve the reliability of a semiconductor device having an imaging function. A semiconductor device includes a package having a cavity and terminals (TE), a semiconductor chip that has an imaging unit and is arranged in the cavity, and a cap material with which the cavity is sealed and which has translucency. In addition, the semiconductor device includes a mounting board that has a through-hole and terminals (TE) and is arranged so as to electrically couple the terminals (TE) to the terminals (TE), a heat transfer member that is inserted into the through-hole and is coupled to the package, and a heat sink coupled to the heat transfer member.

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