The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9728425 B1

PDF
Full Text
Expired
Date of Patent:
Aug. 08, 2017

Filed:

Apr. 02, 2016
Applicant:

Intel Corporation, Santa Clara, CA (US);

Inventors:

Joshua D. Heppner, Chandler, AZ (US);

Serge Roux, Gilbert, AZ (US);

Michael J. Baker, Gilbert, AZ (US);

Javier A. Falcon, Chandler, AZ (US);

Assignee:

INTEL CORPORATION, Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/56 (2006.01); H01L 21/67 (2006.01); B29C 35/08 (2006.01); B29C 70/84 (2006.01); B29C 70/80 (2006.01); B29C 70/88 (2006.01); H01L 23/31 (2006.01); B29K 63/00 (2006.01); B29L 31/34 (2006.01);
U.S. Cl.
CPC ...
H01L 21/563 (2013.01); B29C 35/0805 (2013.01); B29C 70/80 (2013.01); B29C 70/84 (2013.01); B29C 70/882 (2013.01); H01L 21/67126 (2013.01); H01L 23/3157 (2013.01); B29C 2035/0822 (2013.01); B29C 2035/0827 (2013.01); B29K 2063/00 (2013.01); B29K 2995/0005 (2013.01); B29L 2031/3481 (2013.01);
Abstract

Space-efficient underfilling techniques for electronic assemblies are described. According to some such techniques, an underfilling method may comprise mounting an electronic element on a surface of a substrate, dispensing an underfill material upon the surface of the substrate within a dispense region for forming an underfill for the electronic element, and projecting curing rays upon at least a portion of the dispensed underfill material to inhibit an outward flow of dispensed underfill material from the dispense region, and the underfill material may comprise a non-visible light (NVL)-curable material. Other embodiments are described and claimed.


Find Patent Forward Citations

Heppner, Joshua. (2017). Space-efficient underfilling techniques for electronic assemblies (U.S. Patent No. 9728425). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9728425

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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